Laser Scribing Machine

This machine can scribe small slits, small heat affected zone，smooth slit edge without, no cracks. Can be drawn in Auto CAD, CorelDRAW after importing graphics processing; dedicated control software makes editing and modification of the program easy, real-time display show the motion track. Equipped with vacuum，CCD monitoring and vacuum adsorption system.

*Small scribing width, and the cut section of the cell sheet is more neat, and the edge is smoother.

*Optional high-precision CCD visual positioning system, high-speed galvanometer scribing with fast speed

*Automatic transfer of optional ingredient boxes, automatic. feeding of battery sheets, automatic positioning, automatic dicing, automatic loading of finished tablets Such as the system, High degree of automation

It is suitable for monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cell dicing, ceramic, diamond cutting，oxide ceramics for silicon, germanium, gallium arsenide and semiconductor substrates, semiconductor devices and integrated circuits substrate (such as ceramic substrate) dicing; precision cutting and punching of thin metal template, SMT stickers cutting of the tablet template.